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Online: 1374 Piątek, 2017.02.24

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Price hikes for SSDs and eMMCs in second quarter of 2017
piątek, 24 lutego 2017 20:01

DRAMeXchange forecasts that contract prices of both SSDs and eMMCs will see a more moderate sequential price hike of 5~10% in the second quarter. For the first quarter of 2017, DRAMeXchange estimates that the average sequential increases in contract prices of eMMCs and SSDs will come to 15~20% and 10~15%, respectively.

więcej na: www.dramexchange.com

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SK Hynix to make more investment in foundry business
piątek, 24 lutego 2017 18:07

SK Hynix is planning to triple its investment in foundry business this year. Members of the task force are currently conducting research on process optimization, efficiency improvement, sustainable cost reduction, etc. “The exact amount of our investment in foundry business that is to be made this year cannot be revealed,” the company explained, adding, “The investment forms a part of our planned capital expenditure for this year, which totals seven trillion won.”

więcej na: www.businesskorea.co.kr

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Samsung launches premium Exynos 9 built on the world’s first 10nm FinFET process technology
piątek, 24 lutego 2017 15:58

Samsung Electronics announced the launch of its latest premium AP, the Exynos 9 Series 8895. This is Samsung’s first processor chipset to take advantage of the most advanced and industry leading 10 nm FinFET process technology with improved 3D transistor structure, which allows up to 27% higher performance while consuming 40% less power when compared to 14nm technology.

więcej na: news.samsung.com

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TSMC on track to move 5nm to risk production in 1H19
piątek, 24 lutego 2017 13:58

Taiwan Semiconductor Manufacturing Company s on track to start risk production of 5nm chips in the first half of 2019, said company co-CEO Mark Liu. TSMC's 7nm process will be ready for risk production later in the first quarter of 2017, with volume production scheduled for 2018, Liu indicated. TSMC will start using EUV for an improved version of its 7nm process technology, and fully implement the lithography to make 5nm chips, Liu also noted.

więcej na: www.digitimes.com

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LG Innotek unveils the world’s first 70mW UV-C LED
piątek, 24 lutego 2017 12:02

LG Innotek announced that the company has developed the world's first 70mw UV-C LED for sterilization applications. As its sterilization performance is 1.5 times higher than the competitor’s 45mW module. UV-C LED produces the short wavelength ultraviolet rays in the range of 200 - 280nm, al-lowing it to be used for sterilization purpose. It prevents the proliferation of bacteria by de-stroying their DNA.

więcej na: www.lginnotek.com

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Taiwan maintains largest share of global IC wafer fab capacity
piątek, 24 lutego 2017 10:00

IC Insights recently released its new Global Wafer Capacity 2017-2021 report. The Global Wafer Capacity report shows that Taiwan led all regions/countries in wafer capacity with 21.3% share, a slight decrease from 21.7% in 2015 when the country first became the global wafer capacity leader.

więcej na: www.icinsights.com

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Hewlett Packard Enterprise’s sales fall short; outlook disappoints
piątek, 24 lutego 2017 07:51

Hewlett Packard Enterprise said that its fiscal first-quarter sales fell 10 percent from a year ago as the tech giant saw big declines in its bellwether servers and data-storage businesses. And things might not get much better soon as Chief Executive Meg Whitman said the company is seeing “several factors that will be more challenging” as the year goes on.

więcej na: www.siliconvalley.com

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Renesas and Intersil announce final regulatory approval for Renesas' acquisition of Intersil
czwartek, 23 lutego 2017 20:00

Renesas Electronics and Intersil announced that they received notification by the Committee on Foreign Investment in the United States on February 21, 2017 PST; February 22, 2017 JST that the investigation of the merger transaction under which Renesas will acquire Intersil is complete and that there are no unresolved national security concerns with respect to the transaction.

więcej na: newsroom.intersil.com

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Blu Wireless Technology secures backing from ARM
czwartek, 23 lutego 2017 17:56

Blu Wireless Technology has received a significant investment from ARM and other strategic and private investors. This will allow the companies’ mutual customers to deploy high performance mmWave and SDN demanded for the cost-effective deployment of the forthcoming 5G standard. “We are extremely excited by ARM’s investment and our common vision around how next generation wireless networks will be built,” said Henry Nurser, CEO.

więcej na: www.bluwirelesstechnology.com

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SEMI January billings up 52% y-o-y
czwartek, 23 lutego 2017 16:00

SEMI reports January billings of $1.86 billion, 0.5% down on the December level of $1.87 billion, and 52.3% higher than the January 2016 billings level of $1.22 billion. “Global billings reported by the North American equipment makers begin the New Year at high levels,” says SEMI CEO Denny McGuirk, “we expect strong spending growth in 2017 based on investments in leading-edge memory and foundry fabs.”

więcej na: www.electronicsweekly.com

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