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Candy cane supercapacitor could enable fast charging of mobile phones
czwartek, 17 sierpnia 2017 10:03

Supercapacitors promise recharging of phones and other devices in seconds and minutes as opposed to hours for batteries. But current technologies are not usually flexible, have insufficient capacities, and for many their performance quickly degrades with charging cycles. Researchers at QMUL and the University of Cambridge have found a way to improve all three problems in one stroke. Their prototyped polymer electrode, which resembles a candy cane usually hung on a Christmas tree, achieves energy storage close to the theoretical limit, but also demonstrates flexibility and resilience to charge/discharge cycling.

więcej na: phys.org

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Cisco Systems sees sales continue to decline
czwartek, 17 sierpnia 2017 07:52

Cisco Systems reported fiscal fourth-quarter results that were in line with expectations, but also suggested the networking equipment maker is still dealing with a so-called “Trump Effect” that has impacted federal government spending on high-end computing gear. After the stock market closed, Cisco said it earned $2.4 billion, or 48 cents a share, compared to a profit of $2.8 billion, or 56 cents a share, in the same period a year ago.

więcej na: www.siliconvalley.com

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Chip testing firm urges blocking rival Xcerra's sale to China fund
środa, 16 sierpnia 2017 20:09

U.S. semiconductor testing company Cohu Inc is trying to block the sale of rival Xcerra Corp to a Chinese government-controlled fund citing national security concerns, the Wall Street Journal reported. Cohu sent its analysis of the risks related to the proposed sale to the Committee on Foreign Investment in the United States. The CFIUS, a government panel that reviews acquisitions by foreign entities for potential national security risks, has cracked down on technology deals related to the semiconductor industry.

więcej na: www.reuters.com

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Large wafers, complex IC designs among advanced packaging trends
środa, 16 sierpnia 2017 18:03

The global semiconductor advanced packaging market is expected to grow at a CAGR of 8.45% during the period 2017-2021, according to Research and Markets. The latest trend gaining momentum in the market is changes in wafer size. The semiconductor industry has seen a drastic transition in wafer size over the last five decades. The industry is focusing on producing larger diameter wafers, which is expected to cut down the manufacturing cost by 20%-25%. According to the report, one of the other major drivers for this market is complex semiconductor IC designs.

więcej na: electroiq.com

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Foxconn tax breaks pass first hurdle in Wisconsin
środa, 16 sierpnia 2017 15:57

A Wisconsin State Assembly committee approved a US$3 billion tax incentive package for Taiwan-based Foxconn Technology Group, the first vote in what could be an intense month of legislative action to quickly pass the massive deal. The Republican-controlled assembly’s jobs and economy committee voted 8-5 along party lines to send the bill to the full assembly, which plans to take it up tomorrow. Republican-initiated tweaks were approved that attempt to address some concerns raised by critics that the state is giving away too much to win the US$10 billion plant that could employ up to 13,000 workers.

więcej na: www.taipeitimes.com

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Tech ministry to invest NT$4 billion in IC development, aiming AI
środa, 16 sierpnia 2017 14:04

The Ministry of Science and Technology said that it plans to invest NT$4 billion (US$132 million) over the next four years in the local semiconductor sector in a bid to maintain Taiwan's global competitive edge. Science and Technology Minister Chen Liang-gee told the press that the four-year plan code named the "moon shoot" has set its sights on artificial intelligence by widening the applications of Taiwan's integrated circuit industry to meet demand. According to the ministry, the four-year plan will kick off in 2018 as it starts to allocate NT$1 billion a year.

więcej na: focustaiwan.tw

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TrendForce reports YoY gain of 3.6% for 2Q17 notebook shipments
środa, 16 sierpnia 2017 12:02

Market research firm TrendForce reports that the global notebook shipments for this second quarter registered a sequential quarterly increase of 5.7% and a year-on-year increase of 3.6%, totaling 39.96 million units. Biddings for notebook contracts in North America and market arrivals of new product models were the main driving forces behind the second-quarter shipments. As for the entire first half of 2017, the strong demand from North America contributed to a global shipment result that exceeded the market expectations.

więcej na: www.businesswire.com

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Google hires former star Apple engineer for its AI team
środa, 16 sierpnia 2017 10:04

Chris Lattner has joined another rival of the iPhone maker: Alphabet Inc.’s Google, where he will work on artificial intelligence. Lattner announced the news on Twitter, saying he will start next week. His arrival at Mountain View, California-based Google comes after a brief stint as head of the automated driving program at Tesla Inc., which he left in June. Lattner made a name for himself during a decade-plus career at Apple Inc., where he created the popular programming language Swift.

więcej na: www.bloomberg.com

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HiSilicon among top-5 customers of TSMC
środa, 16 sierpnia 2017 07:55

With volume production for its Kirin 970-series chips kicking off, HiSilicon Technologies has become one of Taiwan Semiconductor Manufacturing Company's top-5 customers, according to industry sources. TSMC has already processed 4,000 12-inch wafers for the first batch of orders for HiSilicon's Kirin 970 processor series built using the foundry's 10nm FinFET process technology, said the sources. HiSilicon has also increased orders for its new 10nm chips with shipments set to ramp up in the fourth quarter of 2017, the sources indicated. HiSilicon's 10nm Kirin 970 chips will power Huawei's upcoming flagship model, the Mate 10 - slated for launch this fall, the sources noted.

więcej na: www.digitimes.com

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MapD and Huawei sign MoU to accelerate analytics with GPUs
niedziela, 13 sierpnia 2017 14:40

The leading ICT solution provider Huawei and GPU-powered analytics leader MapD Technologies announced they have signed a Memorandum of Understanding (MoU) to accelerate the application of GPU-powered data analytics at scale. The partnership will enhance compatibility and interconnection between Huawei's FusionServer hardware and the MapD analytics platform, enabling organizations to search and visualize billions of rows of data in milliseconds.

więcej na: prnewswire.com

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