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Online: 565 Czwartek, 2017.06.29

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Foxconn to continue to pursue Toshiba chip unit acquisition
czwartek, 22 czerwca 2017 11:59

Taiwan's Foxconn will continue to pursue an acquisition of Toshiba Corp's chip business, a day after the troubled conglomerate chose a rival suitor as the preferred bidder, the head of Foxconn's Japanese unit said. "We will continue our efforts," Sharp Corp CEO Tai Jeng-wu told reporters on the sidelines of Foxconn's annual shareholders meeting. "We will use our track record, our efforts at Sharp, Foxconn's global reach - we are a global company, not a Taiwan company," Tai said. Foxconn is formally known as Hon Hai Precision Industry Co.

więcej na: www.reuters.com

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GE is building the world’s largest 'additive' machine for 3D printing metals
czwartek, 22 czerwca 2017 09:49

3D printing is growing up. Literally. GE Additive, a new GE business dedicated to supplying 3D printers, materials and engineering consulting services, announced it is developing the world’s largest laser-powered 3D printer that prints parts from metal powder. The printer will be able to make parts that fit inside a cube with 1-meter sides. “The machine will 3D print aviation parts suitable for making jet engine structural components and parts for single-aisle aircraft,” said Mohammad Ehteshami, vice president and general manager of GE Additive.

więcej na: www.gereports.com

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TSMC secures 7nm chip orders from Qualcomm
czwartek, 22 czerwca 2017 07:55

TSMC has regained chip orders from Qualcomm for baseband chips produced on its 7nm process, but not application processors, according to industry sources. Qualcomm is expected to determine whether it will continue to contract Samsung to manufacture its next-generation AP or switch the orders to TSMC when both foundries develop their respective second-generation 7nm process technologies, said the sources. TSMC has disclosed the second generation of its 7nm process using EUV will be ready for volume production in 2019.

więcej na: www.digitimes.com

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Qualcomm is rumored to be working on the Snapdragon 450 SoC
środa, 21 czerwca 2017 19:53

According to the latest rumors, Qualcomm is reportedly working on a new processor, dubbed the Snapdragon 450. The model designation obviously points to a SoC that isn’t intended for the high-end of the mobile market and the rumored specifications back that up as well. While this won’t excite any flagship chasers out there, this could turn out to be good news for many Android users since a large portion of the OS’s market share is comprised of budget and mid-range devices. However, as with all rumors, it’s probably a good idea not to get too worked up in any case.

więcej na: www.androidheadlines.com

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Powerchip to re-enter NOR flash memorychip market
środa, 21 czerwca 2017 17:54

Powerchip Technology Corp said it plans to resume production of NOR flash memory chips in Taiwan to take advantage of a supply crunch. Such a move would make Powerchip the third local company supplying NOR flash memory chips after Macronix International Co and Winbond Electronics Corp. Powerchip’s announcement was unexpected, as the chipmaker had long suspended production of NOR flash memory chips due to a limited market scope and capacity. “The supply of NOR flash memory chips has become tight, because major global suppliers are withdrawing from the market,” Powerchip Group chairman Frank Huang said.

więcej na: www.taipeitimes.com

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Toshiba picks Japan government-Bain group to buy chip unit, big hurdles remain
środa, 21 czerwca 2017 16:05

Toshiba Corp has chosen a consortium of Japanese government investors and Bain Capital as the preferred bidder for its chip business, aiming to seal a deal worth some $18 billion by next week as it scrambles for funds to cover massive losses. But prospects for a clean early resolution to the sale of the world's No. 2 producer of NAND flash chips remain unclear as Western Digital, its chips business partner that has launched legal action to prevent a deal without its consent, was not part of the winning group. The consortium has offered around 2 trillion yen ($18 billion), a Toshiba spokesman said.

więcej na: www.reuters.com

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Raspberry Pi rivals Galileo, Joule, Edison axed by Intel, plus Recon Jet smart glasses
środa, 21 czerwca 2017 14:01

Chip giant Intel's spring cleaning efforts have swept out three of its compute modules for the Internet of Things and several Recon Jet smart glasses products. Affected compute modules include Raspberry Pi challenger developer board, Galileo, as well as the Joule and Edison compute modules. Intel launched the Galileo board in 2013 under a partnership with Arduino, targeting the growing community of developers building systems with ARM-based devices like Raspberry Pi.

więcej na: www.zdnet.com

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AMD launches Zen-based datacenter processors and new GPU accelerators for servers
środa, 21 czerwca 2017 11:56

AMD has launched its EPYC 7000 series high-performance datacenter processors. AMD was joined by multiple customers and partners at the global launch event on June 20 in presenting an array of systems, product demonstrations, and customer testimonials. The EPYC comes with up to 32 high-performance Zen cores and an exclusive feature set. At the event, AMD also launched Radeon Instinct GPU server accelerators including Radeon Instinct MI25, MI18 and MI as well as ROCm 1.6 software platform to help improve performance and efficiency for deep learning and AI calculation.

więcej na: www.digitimes.com

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Cellphone IC sales will top total personal computing in 2017
środa, 21 czerwca 2017 10:06

The ongoing slump in shipments of standard personal computers along with the drop-off in tablets are setting the stage for cellphone IC sales to finally surpass integrated circuit revenues in total personal computing systems this year. IC sales for cellular phone handsets are projected to grow 16% in 2017 to $84.4 billion, while the integrated circuit market for personal computing systems is now forecast to increase 9% to $80.1 billion this year, according to the 150-page update to the 590-page report, originally released in 4Q16.

więcej na: www.icinsights.com

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Synopsys, GlobalFoundries collaborate to deliver design platform and IP enablement for 7nm finFET process
środa, 21 czerwca 2017 07:59

Synopsys, Inc. announced the enablement of the Synopsys Design Platform and DesignWare Embedded Memory IP on GLOBALFOUNDRIES 7-nm Leading-Performance FinFET process technology. Synopsys and GF collaboration on the new process addressed several new challenges specific to the 7LP process. This process is expected to deliver 40 percent more processing power and twice the area scaling compared to GF's 14nm FinFET process. Designers of premium mobile processors, cloud servers and networking infrastructure can take advantage of these benefits by confidently deploying the silicon-proven Synopsys Design Platform and Embedded Memory IP.

więcej na: news.synopsys.com

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