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Online: 1587 Poniedziałek, 2017.03.27

World news 24h Bieżące informacje ze świata w j. angielskim.

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NVIDIA Partners with Bosch for system based on next-generation DRIVE PX Xavier platform
czwartek, 16 marca 2017 16:01

Bosch announced it is working with NVIDIA to develop artificial intelligence self-driving systems for mass market cars. Bosch CEO Dr. Volkmar Denner unveiled the collaboration during his keynote address at Bosch Connected World, in Berlin, at Bosch Group's annual Internet of Things conference. NVIDIA and Bosch are developing an AI self-driving car computer built on NVIDIA's deep learning software and hardware that enables vehicles to be trained on the complexities of driving, operated autonomously and updated over the air with new features and capabilities.

więcej na: nvidianews.nvidia.com

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GoPro cuts another 270 jobs
czwartek, 16 marca 2017 14:03

Despite a disappointing earnings report at the end of 2016, GoPro now expects to land "in the upper end" of its revenue goals for the first quarter of 2017 - somewhere in the neighborhood of $190 million to $210 million. That's the good news. The bad news, according to an announcement distributed to investors Wednesday, is that the company will lay off or eliminate another 270 jobs or open roles as it continues to look for ways to reduce operating expenses.

więcej na: investor.gopro.com

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China IC design industry growing
czwartek, 16 marca 2017 12:01

The "Made in China 2025" plan, published by the China State Council in May of 2015, has demonstrated the country's ambition to enhance its fabless IC design industry in terms of market share and technology capability. Major China-based fabless firms are looking to be capable of developing 10nm and sub-10nm chips in order to expand their global market presence. China has set a goal for its IC design industry of generating US$60 billion in output value and grabbing a 35% share of the global IC design market.

więcej na: www.digitimes.com

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STATS ChipPAC achieves 1.5B unit milestone in fan-out wafer level packaging shipments
czwartek, 16 marca 2017 10:09

STATS ChipPAC Pte. Ltd. announced that it has shipped 1.5 billion fan-out wafer level packages, also known in the industry as embedded Wafer Level Ball Grid Array. In high volume production for over seven years, STATS ChipPAC has led the industry in FOWLP technology innovations and unit shipments. “As an early adopter of FOWLP, STATS ChipPAC set an aggressive course in pushing the boundaries of advanced package architecture and manufacturing capabilities long before its peers.

więcej na: www.statschippac.com

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STMicroelectronics collaborates with iFLYTEK for Chinese voice-recognition cloud services
czwartek, 16 marca 2017 08:05

STMicroelectronics and iFLYTEK have introduced the market’s first IoT development platform that enables voice-recognition cloud services in Chinese. The new platform combines ST’s SensorTile multi-sensor module, STM32 ODE, and Open.software package with iFLYTEK’s voice-recognition technology. It gives designers a complete toolset for the development of voice-enabled Smart-Home, Smart-Driving, IoT, and robotics applications.

więcej na: www.st.com

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Panel, chip demand push up Taiwan tech sales in February
środa, 15 marca 2017 19:50

Sales of major Taiwanese tech companies rose in February on robust demand for panels and semiconductors. Eighteen out of the 19 Taiwanese tech companies monitored by Nikkei Asian Review enjoyed a hike in their revenue in February, with Asustek being the only exception. Overall revenue of the 19 companies advanced 12.32% year-over-year to 764.13 billion New Taiwan dollars ($24.7 billion) in the past month.

więcej na: asia.nikkei.com

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SMIC signs license agreement for invensas' DBI Technology
środa, 15 marca 2017 18:04

Semiconductor Manufacturing International Corporation has executed a technology transfer and license agreement for Invensas’ Direct Bond Interconnect technology. Through this agreement, SMIC will be able to offer this bonding technology for use by image sensor manufacturing customers. Invensas is a wholly owned subsidiary of Xperi Corporation. “As one of the leading foundries, SMIC delivers advanced semiconductor manufacturing processes to device makers around the world, and we are pleased to integrate DBI technology into our capabilities,” said Dr. Tzu-Yin Chiu, SMIC.

więcej na: www.broadwayworld.com

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MediaTek unit sees shares soar on main-board debut
środa, 15 marca 2017 15:55

Embedded microprocessor IP supplier Andes Technology Corp saw its shares soar on the company’s Taiwan Stock Exchange debut. Buying was fueled by hopes that MediaTek would place more orders with the subsidiary, boosting its sales, while many investors have been attracted by the high profit margin enjoyed by the supplier, dealers said. Shares soared about 107 percent from their issue price of NT$65.1 soon after the main board opened and continued to rise until the close of trading.

więcej na: www.taipeitimes.com

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Toshiba shares slide as crisis deepens, fate of Westinghouse unclear
środa, 15 marca 2017 14:03

Shares in Toshiba Corp tumbled after it said it would consider a sale of Westinghouse but did not offer any clarity on whether it would proceed with a Chapter 11 filing for the U.S. nuclear unit - a move that could stem losses. Toshiba's failure to submit audited third-quarter earnings and its announcement of an expanded probe into Westinghouse also contributed to broad disappointment as did the Tokyo Stock Exchange's placing of the stock on its supervision list.

więcej na: www.reuters.com

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Sensata Technologies opens testing facility in Bulgaria
środa, 15 marca 2017 12:06

Sensata Technologies announced the opening of its largest global testing facility in Sofia, Bulgaria. The Testing Laboratory and Mechanization Office is now operational and employs more than 100 highly-skilled engineers and technicians in the areas of durability testing, research and development, field failure analysis and equipment development for Sensata’s automotive sensing technology. The company invested approximately $3 million in the Testing Laboratory and Mechanization Office.

więcej na: pressroom.sensata.com

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