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Imec demonstrates for the first time sub-10nm germanium gate-all-around devices
czwartek, 08 czerwca 2017 08:01

imec unveiled new process improvements for next-generation devices. For the first time, scaled strained germanium p-channel Gate-All-Around FETs are shown with sub-10nm diameter, integrated on a 300mm platform. In addition, the research center has obtained a significant improvement in device performance and electrostatic control with high-pressure anneal for both strained germanium p-channel FinFET and GAA devices. High-mobility materials such as germanium and III-V have been considered as potential solutions for deeply scaled devices, due to their higher intrinsic carrier mobility.

więcej na: www.imec-int.com

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TSMC to have eMRAM in 2018 and eRRAM in 2019
środa, 07 czerwca 2017 20:08

TSMC will be offering embedded MRAM in 2018 and embedded RRAM in 2019. Both technologies will be for the 22nm finfet process node. Last month Samsung announced that foundry customers can have embedded MRAM in their 28nm FD-SOI SoCs. NXP is the first customer. Samsung’s MRAM is said to be 1000 times faster than NAND with unlimited endurance. Samsung says that embedding MRAM only takes four mask-steps, compared to 20 masks for embedded flash, and occupies a third of the silicon real estate taken by SRAM.

więcej na: www.electronicsweekly.com

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ASE reapplies for Chinese approval of SPIL acquisition
środa, 07 czerwca 2017 18:04

Advanced Semiconductor Engineering Inc said in a statement that it has resubmitted an application to Chinese authorities for final approval on a US$4.28 billion bid to acquire rival Siliconware Precision Industries Co. ASE filed an initial application with the Chinese Ministry of Commerce on Aug. 25 last year for a review of the proposed merger. The ministry requires more time to review the merger application, the statement said, adding that “after discussions with the agency, the company has withdrawn the application previously filed with the agency and refiled it.”

więcej na: www.taipeitimes.com

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Japan Display considers deeper restructuring, seeks more funding
środa, 07 czerwca 2017 15:56

Japan Display Inc is considering a deeper restructuring than it first announced, including seeking outside financial help, as its late entry into OLED technology has caused the loss of business with Apple Inc. Japan Display shares climbed 11 percent following the report of the latest possible restructuring in Japan's struggling technology industry. Japan Display is reaching out to investment funds and is looking at capital and business tie-ups. The company will also appoint a new management team at its annual shareholders meeting later this month, and announce a new medium-term business plan by August.

więcej na: www.reuters.com

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Apple announces two new iPad Pros
środa, 07 czerwca 2017 13:52

Apple has introduced a new 10.5-inch iPad Pro and a new 12.9-inch iPad Pro, featuring displays with ProMotion technology and the new A10X Fusion chip. The new 10.5-inch model reduces the borders by nearly 40% to fit into a package that weighs just one pound, according to the vendor. Digitimes previously reported that the upstream supply chain's shipments for Apple's new 10.5-inch iPad Pro have been increasing recently and the device's monthly shipment volume is expected to grow to 600,000 units in July, up from around 500,000 units currently, helping its annual shipments to reach five million units in 2017.

więcej na: www.digitimes.com

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Global semiconductor sales increase 21 percent year-to-year in April
środa, 07 czerwca 2017 12:03

The Semiconductor Industry Association, representing U.S. leadership in semiconductor manufacturing, design, and research, announced worldwide sales of semiconductors reached $31.3 billion for the month of April 2017, an increase of 20.9 percent from the April 2016 total of $25.9 billion and 1.3 percent more than last month’s total of $30.9 billion. April marked the global market’s largest year-to-year growth since September 2010. All monthly sales numbers are compiled by the WSTS organization and represent a three-month moving average.

więcej na: www.semiconductors.org

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Record fab spending for 2017 and 2018
środa, 07 czerwca 2017 10:01

The latest update to the World Fab Forecast report reveals record spending for fab construction and fab equipment. Korea, Taiwan, and China all see large investments, and spending in Europe will also increase significantly. In 2017, over US$49 billion will be spent on equipment alone, a record for the semiconductor industry. Spending on new fab construction is projected to reach over $8 billion, the second largest year on record. Records will shatter again in 2018, when equipment spending will pass $54 billion, and new fab construction spending is forecast at an all-time high of $10 billion.

więcej na: www.semi.org

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Google, San Jose plan search giant’s downtown expansion; up to 20,000 jobs possible
środa, 07 czerwca 2017 07:54

Google is in talks to create a massive tech campus in the heart of downtown San Jose’s Diridon Station area that could accommodate up to 20,000 jobs and transform the area into a transit-oriented tech village. Google and the city are discussing a potential mixed-used development that could include more than 6 million square feet of office and research-and-development space, potentially making it the company’s largest collection of tech offices. It would be larger than the search giant’s roughly 3.1-million-square-foot Mountain View headquarters, known as the Googleplex, which currently is its biggest U.S. work hub.

więcej na: www.siliconvalley.com

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Sk Hynix working on 96- and 128-layer 3D NAND
wtorek, 06 czerwca 2017 20:04

The 64-layer 3D NAND about to land from Micron and Toshiba certainly sounds impressive, but it pales in comparison to what Sk Hynix is working on for future release. The company is developing 96-layer and 128-layer 3D NAND flash. The new flash won't be available for a few years, but that makes it no less exciting. We have yet to see 72-layer 3D from Sk Hynix in our lab, but it will begin shipping soon in the PC401 using 256Gbit TLC die, according to the UNH-IOL list of tested products. The information we found about the successor to 256Gbit 72-layer 3D TLC shows 96 layers with 512Gbit die capacity.

więcej na: www.tomshardware.com

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Samsung Electronics to invest 40 Billion Rupee in India
wtorek, 06 czerwca 2017 18:00

Samsung Electronics Co. is planning to make 40 billion rupee (US$620.84 million) worth of investment in India to double the production of smartphones in the South Asian country. According to governmental and industry sources in India on June 4, the Indian division of Samsung Electronics will expand its existing 120,000-square-meter production line in Noida, Uttar Pradesh, in the northern part of the country, to 240,000 square meters and have its groundbreaking ceremony on the 7th. Samsung Electronics made the purchase of the land next to the Noida plant.

więcej na: www.businesskorea.co.kr

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