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Online: 491 Niedziela, 2017.01.22

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Tsinghua to build the world's largest 3D NAND flash factory in Wuhan
niedziela, 08 stycznia 2017 10:11

China's Tsinghua Unigroup formally announced a total investment of US$24 billion to construct the world's largest 3D NAND Flash factory in Wuhan. The first phase of the plan is to have the commissioning of the factory completed in 2018 and the construction completed in 2020. The factory will have a production capacity of 300,000 chips, and the annual output value will exceed US$10 billion.

więcej na: en.ctimes.com.tw

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Qualcomm unveils new SoC at CES
sobota, 07 stycznia 2017 14:05

Mobile chip giant Qualcomm announced its 10nm Snapdragon 835 at CES 2017. The 835 features an upgraded Kyro 280 eight-core CPU, Hexagon 682 DSP, 540 Adreno GPU, Qualcomm Spectra 180 ISP, Quick Charge 4.0, as well as an integrated X16 LTE modem with what Qualcomm calls “gigabit-class LTE connectivity.” The 835 is also the company’s first ARM-based processor to support Windows 10 on a mobile device.

więcej na: eetimes.com

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Gintech Energy signs with CSC to supply 30MWp of PV modules
sobota, 07 stycznia 2017 10:13

Crystalline silicon solar cell maker Gintech Energy on January 3 announced that it has signed with China Steel (CSC), the largest steel maker in Taiwan, to supply high-efficiency PV modules to set up rooftop PV systems with total installation capacity of 30MWp. CSC and its subsidiaries in August 2016 established a joint venture with initial paid-in capital of NT$4.3 billion (US$134 million) for setting up PV systems with total installation capacity of 80MWp on the roofs of CSC's and its subsidiaries' factory and dormitory buildings.

więcej na: digitimes.com

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4GB DDR3 contract prices rise nearly 30% in 1Q17
czwartek, 05 stycznia 2017 16:35

Contract prices for 4GB DDR3 modules have reached as high as US$25 in the first quarter of 2017 representing a nearly 30% sequential rise, according to DRAMeXchange. ASPs of PC, server and mobile DRAM products are set to increase significantly in the first quarter of 2017, due to ongoing tight supply conditions, said DRAMeXchange. The price rally that began in the second half of 2016 will persist through the first quarter of 2017 despite it being an off-peak season.

więcej na: digitimes.com

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Intel plans to sample a 5G modem in H2
czwartek, 05 stycznia 2017 14:05

Intel is to sample a 5G modem in H2 which is the same timing as Qualcomm has announced for its 5G modem. With a markedly inferior 4G modem to Qualcomm’s, this is an early move in 5G is an attempt to affirm Intel’s position as a player in mobile.

więcej na: electronicsweekly.com

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Samsung’s $150M Fund to support emerging tech
czwartek, 05 stycznia 2017 11:24

Samsung NEXT (formerly Samsung Global Innovation Center) has announced the creation of the Samsung NEXT Fund. This is a $150 million venture capital investment fund set to increase Samsung’s global support of early-stage startups pursuing advanced software and services innovation. The Fund is designed to empower tech entrepreneurs with funding, resources and deep-domain expertise.

więcej na: electronicsnews.com.au

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Chip sales grew sharply in november
czwartek, 05 stycznia 2017 08:45

Semiconductor posted a year-to-year sales increase of 7.4% in November 2016 as the chip industry continued to pick up steam headed into the end of the year, according to the Semiconductor Industry Association (SIA) trade group. The November increase was the largest for the semiconductor industry since January 2015, the SIA said.

więcej na: eetimes.com

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Qualcomm to Invest in SoftBank’s New Technology Fund
środa, 04 stycznia 2017 16:36

Qualcomm Inc., the largest maker of mobile phone chips, will invest in a new $100 billion technology fund that Japan’s SoftBank Group Corp. plans to launch this year, the Wall Street Journal reported. Qualcomm would join Apple Inc., which has also considered investing as much as $1 billion in the SoftBank fund, people familiar with the matter said earlier.

więcej na: bloomberg.com

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TSMC on track for volume production of 7nm chips for iPhone, iPad in 2018
środa, 04 stycznia 2017 13:44

Apple chip manufacturer TSMC is reportedly on schedule to receive the first designs for chips using the 7nm FinFET process in the second quarter of 2017. According to supply chain reports from the Commercial Times, the first prototype chips in the 7nm FinFET process will be available in the second quarter just after "tape out" is complete, with full volume production in early 2018, in time for that fall's refresh of the iPhone.

więcej na: appleinsider.com

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SDP to set up 10.5G LCD display park in southern China
środa, 04 stycznia 2017 11:07

Japan-based Sakai Display Products (SDP) has signed with the Guangzhou city government for cooperation to set up a 10.5G LCD display park in the southern Chinese city with total investment of CNY61.0 billion (US$8.84 billion). The park will consist of a 10.5G IGZO TFT-LCD factory with monthly production capacity of about 90,000 3,370mm x 2,940mm glass substrates, a smart LCD TV factory and an electronic white board factory, according to the company. Construction of the factories will begin in March 2017 and production will kick off in 2019.

więcej na: digitimes.com

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