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BlackBerry downplays Toyota's use of rival software
wtorek, 06 czerwca 2017 16:04

BlackBerry Ltd downplayed news that Toyota Motor Corp would adopt rival software for its future vehicle consoles, saying it was more focused on the faster-growing market for autonomous driving technology. Automotive Grade Linux said last week that Toyota would start using its open-source software in Entune 3.0 consoles of its 2018 Camry sedans, before deploying it in most Toyota and Lexus vehicles sold in North America. BlackBerry Chief Operating Officer Marty Beard said in a blog posting that he expected AGL to take a share of the automotive infotainment market, where BlackBerry's QNX is a dominant supplier.

więcej na: www.reuters.com

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iMac Pro, the most powerful Mac ever
wtorek, 06 czerwca 2017 13:59

Apple gave a sneak peek of iMac Pro, an entirely new workstation-class product line designed for pro users with the most demanding workflows. The all-new iMac Pro, with its gorgeous 27-inch Retina 5K display, up to 18-core Xeon processors and up to 22 Teraflops of graphics computation, is the most powerful Mac ever made. Featuring a stunning new space gray enclosure, iMac Pro packs incredible performance for advanced graphics editing, virtual reality content creation and real-time 3D rendering. iMac Pro is scheduled to ship in December starting at $4,999.

więcej na: www.apple.com

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BOE, CSOT plan to set up more 10.5G, 11G panel lines
wtorek, 06 czerwca 2017 11:59

China-based panel makers BOE Technology and China Star Optoelectronics Technology are setting up a 10.5G TFT-LCD panel factory and a 11G one respectively and plan to build another 10.5G plant and an 11G one respectively to produce AMOLED TV applications in addition to LCD panels, according to industry sources. BOE is setting up a 10.5G LCD factory in Hefei, northern China, and plans to set up another in Wuhan, central China, while CSOT is setting up a 11G line in Shenzhen, southern China, and plans to construct another beside it, the sources said.

więcej na: www.digitimes.com

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Mentor OSAT Alliance program streamlines IC high-density advanced packaging design and manufacturing
wtorek, 06 czerwca 2017 10:00

Mentor, a Siemens business, announced that it has launched the Mentor OSAT Alliance program to help drive ecosystem capabilities in support of new HDAP technologies like 2.5D IC, 3D IC and FOWLP for customer IC designs. By launching this program, Mentor will work with OSATs to provide fabless companies with design kits, certified tools, and best practices to aid in smoother adoption of these new packaging solutions that require a much tighter link between chip and package design. Mentor also announced Amkor Technology, Inc. as its first OSAT Alliance member.

więcej na: www.prnewswire.com

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Seeing the invisible with a graphene-CMOS integrated device
wtorek, 06 czerwca 2017 07:59

Silicon based CMOS technology has truly shaped our world. It enables most of the electronics that we rely on today. However, to continue the path of progress in the electronics industry new technology must be developed and a key feature of this is the ability to integrate CMOS with other semiconductors. Now, Graphene Flagship researchers from ICFO have shown that it is possible to integrate graphene into a CMOS integrated circuit. They combine this graphene-CMOS device with quantum dots to create an array of photodetectors, producing a high resolution image sensor. When used as a digital camera this device is able to sense UV, visible and infrared light at the same time.

więcej na: graphene-flagship.eu

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Infineon and DGIST set up auto lab
poniedziałek, 05 czerwca 2017 20:08

Infineon and Korea’s DGIST are to set up an automobile laboratory in Korea. The lab will work on automotive radars and their applications, developing reference software and on automotive semiconductor technology. The DGIST and Infineon have been co-operating since 2014 maintaining s industry-academia cooperation for regular technical exchange and cooperation projects. “P’The opening of this laboratory will help increase the competitiveness of Korea’s future automobile technology and enhance the capabilities of the Korean automobile industry that is a national strategic industry,’ says the DGIT press release.

więcej na: www.electronicsweekly.com

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Taiwan shares end at 17-year high; TSMC market cap hits record level
poniedziałek, 05 czerwca 2017 17:56

Shares in Taiwan closed at a 17-year high with the bellwether electronics sector continuing its momentum as local investors took their cue from record highs posted by three major indexes on Wall Street overnight, dealers said. Taiwan Semiconductor Manufacturing Co., the most heavily weighted stock on the local market, led the electronics sector higher after its shares rose to record levels, boosting market capitalization on the back of foreign institutional buying, they said. However, turnover remained moderate with many investors remaining on the sidelines, waiting for the release of U.S. jobs data later in the day, they added.

więcej na: www.chinapost.com.tw

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Q1 NAND price up 20-25%
poniedziałek, 05 czerwca 2017 16:01

The NAND contract price went up 20-25% in Q1, reports DRAMeXchange. “The overall production capacity for 2D-NAND has fallen during the industry-wide migration to 3D-NAND manufacturing,” says DRAMeXchange’s Alan Chen, “as the market has yet to regain its balance following this disruption, contract prices of NAND flash chips will keep going up.” DRAMeXchange expects shortages will last all year and that NAND suppliers will see increasing revenues through to the end of 2017.

więcej na: www.electronicsweekly.com

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Qualcomm-NXP deal faces EU snag
poniedziałek, 05 czerwca 2017 13:48

As Qualcomm continues its lonely courtroom battle against the world, the San Diego-based smartphone chip behemoth is fighting for approvals of its proposed NXP acquisition with a global army of antitrust regulators. After the relatively lenient U.S. antitrust forces cleared the merger without conditions, Qualcomm’s next hurdle is a preliminary review by the EU competition authority, set to conclude on June 9. The EU could approve the deal with or without conditions.

więcej na: www.eetimes.com

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Foxconn says Apple, Amazon to join its bid for Toshiba chip business
poniedziałek, 05 czerwca 2017 12:02

Apple Inc and Amazon.com Inc will join Foxconn's bid for Toshiba Corp's semiconductor business, the Nikkei business daily quoted Foxconn Chairman Terry Gou as saying on Monday. The two U.S. technology giants plan to "chip in funds", Gou said, according the interview with the newspaper. It was not immediately clear if this would take the form of a direct investment in the semiconductor unit or would be financing for the deal. Taiwan's Foxconn, formally known as Hon Hai Precision Industry Co Ltd, has also partnered with its Japanese unit Sharp Corp in its bid.

więcej na: www.reuters.com

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