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Online: 543 Poniedziałek, 2018.06.25

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TT Electronics introduces SMD power inductors
niedziela, 24 czerwca 2018 19:52

TT Electronics has introduced SMD power inductors for use in high power density applications where size is critical. The low-profile devices are suitable for use in DC-DC converters using high switching frequencies up to 3MHz as well as EMI and low pass DC filters. Applications in the transportation field include powertrain, engine control, transmission control, LED driver, ABS braking systems, EPS, radar systems, and camera control systems. In the industrial sector they are suirable for use in automation systems as well as DC-DC converters. The HA66 series is a low profile, low loss, ferrite-based inductor designed with a wide range of inductances and package sizes. The series comprises a range of 38 inductors with inductance ratings from 2.5 to 220µH, DC resistances from 0.018 to 0.820Ω and Irms values from 1.22 to 11.2A.

więcej na: www.electronicsweekly.com

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Taiwan's Foxconn calls Sino-U.S. trade spat a 'tech war'
niedziela, 24 czerwca 2018 16:00

Foxconn said the U.S. and Chinese governments are engaged in a technology war, not a trade war, describing the spat as the biggest challenge the Taiwanese company is facing. President Donald Trump said Washington would hit $200 billion of Chinese imports with 10 percent tariffs if Beijing retaliates against his previous announcement to target $50 billion in imports. The United States has accused China of stealing U.S. intellectual property, a charge Beijing denies. “The biggest challenge we’re facing is the U.S.-China trade war. In terms of how we manage and adapt, this is something all our high-level managers are making various plans on,” Chairman Terry Gou said at the company’s annual general meeting.

więcej na: www.reuters.com

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TSMC develops SiP technology
niedziela, 24 czerwca 2018 12:08

Pure-play foundry Taiwan Semiconductor Manufacturing Company has been enhancing its IC packaging capability by developing system-level packaging technology. TSMC has become a competitor to IC packaging specialists, such as ASE Industrial Holding, with its CoWoS and integrated fan-out wafer-level packaging. While continuing to enhance its backend CoWoS and InFO services, TSMC has developed its system-level packaging technology to step into the advanced SiP field. Called system-on-integrated-chips, TSMC's SiP technology will be competing with its counterparts rolled out by the world's major dedicated packaging companies like ASE and Amkor in the 5G era, according to market sources. SoIC was first introduced by TSMC at its technology symposium held recently in Silicon Valley.

więcej na: www.digitimes.com

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Ericsson needs industries to embrace 5G to underpin its recovery
niedziela, 24 czerwca 2018 07:53

Ericsson needs a range of industries to embrace 5G network services if the equipment maker is to get a long-term boost that would allow it to progress from cost-cutting to expansion. For now, the Swedish company is focusing on a cost-savings plan running until 2020 to shore up profitability, hoping that growth will then return as the pace of 5G network upgrades picks up early in the following decade. Having struggled with flagging revenue since 4G sales peaked in the middle of the decade, Ericsson is pinning its hopes for revived growth on the emergence of new mobile businesses in 10 broad sectors such as manufacturing, energy and public safety.

więcej na: www.reuters.com

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UK's M&S, Microsoft sign artificial intelligence deal
sobota, 23 czerwca 2018 19:58

Britain’s Marks & Spencer has signed a strategic partnership deal with Microsoft to test the integration of artificial intelligence technologies into the retailer’s stores and operations. The deal will see Microsoft’s AI engineers work with M&S’s engineers to examine how the technology can benefit customers and increase efficiency in its business. No financial details of the deal were disclosed.

więcej na: www.reuters.com

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Google staff reportedly refused to work on government security tool
sobota, 23 czerwca 2018 15:55

Bloomberg reports that earlier this year, a group of Google employees refused to work on a security tool that would have opened up more military contracts to the company. The tool in question is air gap technology that would be key to the development of the secure cloud configurations required by government agencies. Without it, Google might be left in the "Moderate" security rating it has been granted by the Federal Risk and Authorization Management Program, while others like Microsoft and Amazon have products with "High" ratings that give them access to additional contracts. Current and former Google employees told Bloomberg that those against the project - who became known as the "Group of Nine" - had concerns about working on a tool that might help the government wage war.

więcej na: www.engadget.com

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China AI unicorns grow stronger on fresh financial injections
sobota, 23 czerwca 2018 11:59

China's AI sector has witnessed a new round of fundraising campaigns, with a flurry of investment deals completed over the past few weeks to make AI unicorns there stronger, according to industry sources. The latest funding deal, completed on June 20, was closed by AI chipmaker Cambricon Technologies. In its series B funding round, the company raised millions of US dollars from investors including state-backed venture capital funds such as China State-Owned Capital Venture Investment Fund, SDIC Venture Capital and China Reform Fund, as well as companies like Alibaba Group, Lenovo and Incubator Group.

więcej na: www.digitimes.com

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Tesla to close a dozen solar facilities in nine states
sobota, 23 czerwca 2018 08:01

Electric car maker Tesla Inc’s move last week to cut 9 percent of its workforce will sharply downsize the residential solar business it bought two years ago in a controversial $2.6 billion deal, according to three internal company documents and seven current and former Tesla solar employees. The latest cuts to the division that was once SolarCity - a sales and installation company founded by two cousins of Tesla CEO Elon Musk - include closing about a dozen installation facilities, according to internal company documents, and ending a retail partnership with Home Depot Inc that the current and former employees said generated about half of its sales. About 60 installation facilities remain open, according to an internal company list reviewed by Reuters.

więcej na: www.reuters.com

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Samsung introduces 8TB SSD
piątek, 22 czerwca 2018 20:04

Samsung Electronics announced that it has launched the industry’s highest capacity NVMe solid state drive based on the incredibly small Next-generation Small Form Factor - an eight-terabyte NF1 SSD. The new 8TB NVMe NF1 SSD has been optimized for data-intensive analytics and virtualization applications in next-generation data centers and enterprise server systems. “By introducing the first NF1 NVMe SSD, Samsung is taking the investment efficiency in data centers to new heights,” said Sewon Chun, senior vice president of Memory Marketing at Samsung Electronics. “We will continue to lead the trend toward enabling ultra-high density data centers and enterprise systems by delivering storage solutions with unparalleled performance and density levels.”

więcej na: news.samsung.com

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TSMC likely to make Qualcomm 7nm Snapdragon chips
piątek, 22 czerwca 2018 18:00

Speculation has been circulating that Qualcomm will return to TSMC for 7nm. Industry sources believe that the foundry with its 7nm FinFET process node will win back its major contract with the US chip vendor at the end of 2018 or early 2019. Qualcomm will place orders for its next-generation Snapdragon 800 chip series with TSMC given the foundry's more competitive 7nm node manufacturing, according to the sources. Qualcomm will also have TSMC fabricate its 5G modem chips, said the sources. TSMC had long been Qualcomm's foundry partner before Samsung won 14nm and 10nm Snapdragon chip orders. Qualcomm started to partner with TSMC in the development of 65nm chips in 2006, and the pair extended their collaboration to 45nm and 28nm process manufacturing.

więcej na: www.digitimes.com

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