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Online: 536 Sobota, 2017.12.16

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Toshiba, Western Digital aiming to settle chip dispute next week
sobota, 09 grudnia 2017 20:00

Toshiba Corp and Western Digital Corp have agreed in principle to settle a dispute over the Japanese firm’s plans to sell its $18 billion chip unit and aim to have a final agreement in place next week, sources familiar with the matter said. The potential for Western Digital - Toshiba’s partner in its main semiconductor plant and jilted suitor in the auction - to block a deal has been seen as the main obstacle to the planned sale of the unit to a Bain Capital-led consortium. The settlement under discussion calls for Western Digital to drop arbitration claims seeking to stop the sale in exchange for Toshiba allowing it to invest in a new production line for advanced flash memory chips that is slated to start next year, two sources said.

więcej na: www.reuters.com

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China IC design industry tops $30bn
sobota, 09 grudnia 2017 15:55

China’s IC design industry revenue will reach $30 billion in 2017, says Trendforce, and a growth rate of 20% is expected to deliver $36 billion industry revenue in 2018. HiSilicon and Sanechips provide NB-IoT chipS, Cambricon Technologies and Horizon Robotics are developing AI chips. Unigroup Spreadtrum RDA, Datang, and HiSilicon have made chips for 5G. Datang Semiconductor drops out of Trendforce! China top ten, with WillSemi and GigaDevice entering the list. HiSilicon grew revenues more than 25% due to the increasing penetration rate of Kirin chips in phones. Tsinghua Unigroup Subsidiaries Spreadtrum and RDA had a drop in revenue because of competition in the low- and mid-range mobile IC market.

więcej na: www.electronicsweekly.com

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Microsoft Azure adopts AMD EPYC
sobota, 09 grudnia 2017 12:00

AMD has announced the first public cloud instances powered by its EPYC processor. Microsoft Azure has deployed AMD EPYC processors in its datacenters in advance of preview for its latest L-Series of Virtual Machines for storage optimized workloads. The Lv2 VM family will take advantage of the high-core count and connectivity support of the EPYC processor, according to AMD. "We are extremely excited to be partnering with Microsoft Azure to bring the power of AMD EPYC processors into their datacenter," said Scott Aylor, corporate vice president and general manager of Enterprise Solutions, AMD.

więcej na: www.digitimes.com

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Next Huawei flagship will feature an iPhone X-like notch
sobota, 09 grudnia 2017 07:57

The weird notch that's probably the defining trait of the iPhone X seems like a love or hate affair, as you can either like it or find it annoying. In any case, let's agree that it's a controversial feature that might or might not make it in future iPhones. Just like many times in the past, Apple and Android smartphones market are borrowing design features or technologies from each other. Obviously, that's not bad at all since we all want the best of the best when we buy a new flagship. Well, it looks like Huawei wants to take that controversial notch design feature, which is also part of the Android-powered Essential Phone, and put it on one of its upcoming flagships, possibly the P11.

więcej na: www.phonearena.com

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Kyocera shows its smallest capacitor
piątek, 08 grudnia 2017 20:08

Kyocera Corporation announced that it has developed new multilayer ceramic capacitors for mobile device applications in a 008004 case size, among the world’s smallest. Measuring just 0.25 x 0.125 x 0.125mm, Kyocera’s new CM01 Series MLCCs reduce space requirements by 60% in surface area and 75% in total volume as compared to conventional products. The trend toward smaller, more highly functional telecommunications equipment has increased component requirements within smartphones, wearables and related devices - creating particular demand for ultra-miniature MLCCs to facilitate greater circuit densities. In response to this demand, Kyocera’s new CM01 Series’ ultra-compact size will help circuit designers create more capable and functional products.

więcej na: global.kyocera.com

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TSMC says latest chip plant will cost around $20 bln
piątek, 08 grudnia 2017 17:58

Taiwan Semiconductor Manufacturing Co Ltd said a planned new factory would cost the world’s largest contract chipmaker around $20 billion. TSMC in September said it would build a semiconductor fab in Taiwan dedicated to 3 nm technology. It did not say when the project will begin or end. “This fab could cost upwards of $20 billion and represents TSMC’s commitment to drive technology forward,” Co-Chief Executive Mark Liu, who will succeed Morris Chang as chairman next year, said at the firm’s supply chain management forum. Liu also identified growth areas as artificial intelligence and fifth-generation mobile communication networks, the chips for which TSMC is already offering. “Current 5G development progress points to 2019 as the year of volume deployment,” Liu said.

więcej na: www.reuters.com

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SK Group maintains heads of chip, construction arms
piątek, 08 grudnia 2017 15:56

SK Group said it decided to maintain the heads of its semiconductor and construction arms, refraining from making significant changes in its structure. Announcing its regular reshuffle, the telecom and tech conglomerate said Park Sung-wook, the chief executive officer of the crucial SK hynix Inc., and Cho Ki-Haeng, the head of SK Engineering & Construction Co., will maintain their seats. Industry watchers said the decision for SK hynix apparently came as the company has been posting record-breaking performances throughout 2017. Cho Kyong-Mok, the chief financial officer of SK Holding Co., was named to head SK Energy Co. The conglomerate said the appointments were limited as the group already implemented major personnel reshuffle last year.

więcej na: english.yonhapnews.co.kr

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Samsung India to hire 1000 engineering graduates
piątek, 08 grudnia 2017 14:01

Samsung India plans to hire 1,000 graduates from top engineering colleges across the country in 2018 with over 300 of them coming in from various IITs, a top company official said. Most of these engineers are expected to be hired for new-age domains like artificial intelligence, Internet of Things, machine learning, biometrics, natural language processing, augmented reality and networks including 5G. Apart from IITs, Samsung will also be hiring talent from premier institutes like Delhi College of Engineering, BITS Pilani, Manipal Institute of Technology and IIITs among others.

więcej na: www.easterneye.eu

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Chinese investor raises stake in Dialog Semi to 8.15 percent
piątek, 08 grudnia 2017 11:54

China’s top state silicon chipmaker has raised its stake in Dialog Semiconductor, buying into share price weakness triggered by fears the Anglo-German firm could lose its top customer Apple Inc. Tsinghua Unigroup, through two wholly owned units, controls an 8.15 percent voting stake, Frankfurt-listed Dialog said in a filing. That is up one percentage point since the last disclosure by Dialog on Tuesday. Tsinghua Unigroup, which has not responded to requests for comment, has in the past been blocked on U.S. national security grounds in its attempts to take over Western chip makers, including Germany’s Aixtron SE. Tsinghua Unigroup, now Dialog’s largest shareholder, also controls Spreadtrum Communications, a developer of mobile chipset platforms for smartphones with which Dialog cooperates in China.

więcej na: www.reuters.com

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12-inch silicon wafer ASP to rise 20-30% on year in 4Q17
piątek, 08 grudnia 2017 10:01

The average selling price for 12-inch silicon wafers is estimated to surge 20-30% on year in the fourth quarter of 2017, and is expected to enjoy the same annual growth rate in the corresponding quarter of 2018, according to Digitimes Research. After experiencing an oversupply for 10 years through the first half of 2016, many silicon wafer suppliers have seen fierce competition among wafer foundry houses for their capacities since the second half of 2016. And the suppliers have based the allocation of their capacities on whether foundry houses are willing to sign 2-3-year cooperation pacts and share their blueprints for technology and product development. With this, silicon wafer suppliers will see their profits hit 10-year highs in 2018, Digitimes Research believes.

więcej na: www.digitimes.com

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