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Cree launches industry’s first extreme density LED
piątek, 08 grudnia 2017 07:56

Cree, Inc. announces the commercial availability of the XLamp® XD16 LED, the industry’s first Extreme Density LED, which delivers up to 5½ times higher lumen density than Cree’s previous generation of high power LEDs. Built on Cree’s groundbreaking NX Technology Platform, the XD16 LED combines breakthrough lumen density, low optical cross-talk, unsurpassed thermal contact and ease of system manufacturing to enable innovative new designs for a broad spectrum of lighting applications, such as color-tuning, street, portable and industrial. “Cree’s new XD16 LED delivers an incredible amount of light output for such a tiny package,” said Joe Skrivan, senior technical director at Black Diamond Equipment.

więcej na: www.cree.com

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Fujitsu bonds diamond to SiC at room temperature
czwartek, 07 grudnia 2017 20:05

Fujitsu has developed a technology for bonding single-crystal diamond to a SiC substrate at room temperature. Using this technology for heat dissipation in a high-power GaN high HEMT enables stable operations at high power levels. Application of this technology is expected to significantly enhance the performance of weather radars and wireless communications. Single-crystal diamond is known to have good thermal conductivity, but with existing technologies, the argon beams used to remove impurities in the manufacturing process create a low-density damaged layer on the surface, which weakens bonding strength. Now, by protecting the surface of the diamond with an extremely thin metallic film, Fujitsu has succeeded in preventing the formation of the damaged layer and bonding single-crystal diamond to a SiC substrate at “room-temperature bonding”.

więcej na: www.electronicsweekly.com

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Casetek to receive iPhone orders
czwartek, 07 grudnia 2017 17:59

Casetek Holding Ltd is expected to enter the supply chain for Apple Inc’s iPhones next year, after years of preparation, a source said. “Pegatron’s strong capability to assemble ‘thousands’ of components and integrate systems will help Casetek to deliver handset casing that combine glass and aluminum alloys,” a person familiar with the matter told a small group of reporters on condition of anonymity. Casetek supplies metal casings for Apple’s iPads and MacBooks. It has expressed interest in expanding its presence in the Apple supply chain for years.

więcej na: www.taipeitimes.com

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Broadcom projects robust sales on strong smartphone demand
czwartek, 07 grudnia 2017 16:07

Broadcom Ltd. gave an upbeat sales forecast, indicating that its smartphone customers are optimistic about demand. Revenue in the period that ends Feb. 4 will be about $5.3 billion, the San Jose, California-based company said in a statement. That compares with analysts’ average estimate of $4.83 billion, according to data compiled by Bloomberg. The forecast includes a partial contribution from the recently acquired networking business of Brocade Communications Systems Inc. Chief Executive Officer Hock Tan has led his company’s climb up the ranks of chipmakers in the past three years through a series of acquisitions.

więcej na: www.bloomberg.com

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Qualcomm adds security, battery life features to phone chips
czwartek, 07 grudnia 2017 14:02

Qualcomm Inc revealed new security and battery life features on its latest Snapdragon 845 mobile phone processor, a chip that customarily powers high-end Android-based phones from Samsung Electronics Co Ltd and others. The chips are increasingly important to Qualcomm’s financial picture while its patent licensing business is under attack from Apple Inc. Qualcomm’s latest chip features a range of improvements to help it deal with artificial intelligence tasks like recognizing and categorizing images, Keith Kressin, a senior vice president at the company, told Reuters in an interview. For the first time, Qualcomm’s Snapdragon chip also features physically separate processor called a “Secure Processing Unit” for storing information like fingerprints and iris scans, similar to technology found on Apple’s iPhone.

więcej na: www.reuters.com

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Sanan Optoelectronics to set up LED production base in southeastern China
czwartek, 07 grudnia 2017 11:53

The largest China-based LED epitaxial wafer and chip maker Sanan Optoelectronics has announced it will invest CNY33.3 billion to set up an LED production base in Quanzhou, southeastern China. The production at the base will mainly consist of GaN substrates, epitaxial wafers and chips, GaAs epitaxial wafers and chips and high-power GaN lasers. All production lines will come into operation in five years and reach a high level of capacity utilization with target total annual revenues of CNY27 billion in seven years. Sanan, compared to active capacity expansion by China-based fellow makers including HC SemiTek, Huaian Aucksun Optoelectronics Technology and Xiamen Changelight, only slightly expanded production capacity in 2017.

więcej na: www.digitimes.com

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Leti integrates hybrid III-V silicon lasers on 200mm wafers using standard CMOS process
czwartek, 07 grudnia 2017 10:02

Leti, a research institute of CEA Tech, has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow. This breakthrough shows the way to transitioning away from 100mm wafers and a process based on bulk III-V technology that requires contacts with noble metals and lift-off based patterning. The project, carried out in the framework of the IRT Nanoelec program, which is headed by Leti, demonstrated that the hybrid device’s performance is comparable to the reference device fabricated with the current process on 100mm wafers. The fabrication flow is fully planar and compatible with large-scale integration on silicon-photonic circuits.

więcej na: www.leti-cea.com

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Automotive and IoT will drive IC growth through 2021
czwartek, 07 grudnia 2017 07:59

Integrated circuit sales for automotive systems and the Internet of Things are forecast to grow 70% faster than total IC revenues between 2016 and 2021, according to IC Insights. ICs used in automobiles and other vehicles are forecast to generate worldwide sales of $42.9 billion in 2021 compared to $22.9 billion in 2016, while integrated circuit revenues for IoT functionality in a wide range of systems, sensors, and objects are expected to reach $34.2 billion in four years compared to $18.4 billion last year, says the new 358-page report. Between 2016 and 2021, automotive and IoT IC sales are projected to rise by compound annual growth rates of 13.4% and 13.2%, respectively, compared to 7.9% for the entire IC market, which is projected to reach $434.5 billion in four years versus $297.7 billion last year.

więcej na: www.icinsights.com

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Macronix comes up with new 3D NAND structure
środa, 06 grudnia 2017 19:57

Macronix is releasing details of a new 3D NAND structure, called single-gate vertical channel. The paper selected focuses on realizing a 128Gb MLC 3D NAND Flash using the SGVC architecture with only 16 layers. Such memory density is comparable to 48-layer 3D NAND using a popular gate-all-around structure. SGVC has the important advantage of much smaller cell size and pitch scaling capability which allows very high density memory with many fewer stacking layers. The 3D SGVC NAND makes use of arrays of vertically arranged single-gate flat-cell thin film transistors with an ultra thin body, which aren't as sensitive to variation of critical dimensions as GAA devices, and is very suitable for read-intensive memory applications. No clear idea if this will ever make a product, but apparently the technology is feasible.

więcej na: www.fudzilla.com

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Apple wins EU trademark case against Xiaomi
środa, 06 grudnia 2017 18:08

Apple Inc succeeded in preventing Chinese smartphone maker Xiaomi Inc from registering its “Mi Pad” tablet computer as an EU trademark because the name was too similar to Apple’s “iPad”. The European Union’s second-highest court, the General Court, ruled that Mi Pad should not be registered as a trademark because consumers were likely to be confused by the similarity of the signs. Xiaomi’s Mi Pad and Apple’s iPad are both tablet computers. “The dissimilarity between the signs at issue, resulting from the presence of the additional letter ‘m’ at the beginning of ”Mi Pad“, is not sufficient to offset the high degree of visual and phonetic similarity between the two signs,” the Court said in a statement.

więcej na: www.reuters.com

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