Od września w ofercie TME można znaleźć elementy pasywne produkcji Yageo. Dostępne są rezystory SMD (0402, 0603, 0805, 1206), kondensatory ceramiczne SMD (0603, 0805, 1206), dławiki SMD (0805, 1206,1812) oraz koraliki przeciwzakłóceniowe SMD (0603, 0805, 1206).
A ramp-up of orders for communications chips, as well as TV panel-use driver ICs and TDDI chips, will enable Taiwan-based IC backend firms to enjoy a particularly strong fourth quarter of 2017, according to industry sources. With Apple introducing its latest iPhone series, the iPhone-related IC backend service providers including ASE, Chipbond Technology, KYEC and Lingsen Precision Industries are expected to report brisk sales results starting September, the sources said. ASE reportedly provides SiP services for the manufacture of RF and Wi-Fi modules for use in the recently-introduced iPhone series, while KYEC is engaged in the supply chain for the new iPhone devices by providing Intel testing services for modem chips.
więcej na: www.digitimes.com
