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Online: 1186 Wtorek, 2017.11.21


Nowe cenniki Astat

piątek, 17 kwietnia 2009 10:22
Astat poinformował na swojej stronie internetowej o nowych, obowiązujących od marca, cennikach produktów Servodan oraz Elbrolight.

World News 24h

wtorek, 21 listopada 2017 16:09

Chinese foundry SMIC has added direct bond interconnect capability from Invensas at its Avezzano, Italy, wafer fab. Invensas is a wholly owned subsidiary of Xperi Corp. The addition of DBI enables SMIC to manufacture hybrid stacked backside illuminated image sensors, as well as other semiconductor devices for applications in smartphones and automobiles. SMIC and Invensas previously signed a development license in March 2017. DBI technology is a low temperature hybrid wafer bonding solution that allows wafers to be bonded with scalable fine pitch 3D electrical interconnect without requiring bond pressure. DBI 3D interconnect can eliminate the need for through-silicon vias and reduce die size and cost while enabling pixel level interconnect for future generations of image sensors.

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