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Online: 1537 Wtorek, 2017.11.21


Zamel Gazelą 2009

wtorek, 09 lutego 2010 14:22

Zamel po raz siódmy znalazł się w rankingu firm wyróżnionych przez Puls Biznesu tytułem Gazeli Biznesu 2009.


World News 24h

wtorek, 21 listopada 2017 16:09

Chinese foundry SMIC has added direct bond interconnect capability from Invensas at its Avezzano, Italy, wafer fab. Invensas is a wholly owned subsidiary of Xperi Corp. The addition of DBI enables SMIC to manufacture hybrid stacked backside illuminated image sensors, as well as other semiconductor devices for applications in smartphones and automobiles. SMIC and Invensas previously signed a development license in March 2017. DBI technology is a low temperature hybrid wafer bonding solution that allows wafers to be bonded with scalable fine pitch 3D electrical interconnect without requiring bond pressure. DBI 3D interconnect can eliminate the need for through-silicon vias and reduce die size and cost while enabling pixel level interconnect for future generations of image sensors.

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